Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:


New protocol revolutionizes 3D-design

Verse, a protocol for 3D-applications, opens new possibilities for users to collaborate in real-time between different sites or just different applications. Architects and customers can for example collaborate on the design of a building, over the Internet.

The protocol and applications utilizing the protocol are developed in a project called Uni-Verse coordinated by KTH, the Royal Institute of Technology, Stockholm, Sweden. The project is funded by the European Commission.

Verse can replace time-consuming file transfers and cumbersome file conversion with real-time communication. Instead of storing 3D objects as files, they are stored in a server, which can run locally or at a remote location. Applications connected to the server will automatically get up to date copies of the 3D data. All changes are transferred directly when they are made. This means that all applications can work together with the most recent 3D data.

“Users at different locations can collaborate with a 3D design, but Verse can also connect applications on the same computer. Connected applications work together and behave in the same way as a single application would do” says Gert Svensson, Uni-Verse coordinator.

The Verse protocol and most of the tools developed in the project are open source in the same way as the operating system Linux. This means that the protocol and the tools including source code can be downloaded from the web and used freely. The project also develops advanced tools for sound and acoustic simulation. Typical applications areas for the Verse protocol and the Uni-Verse tools include areas like content creation for games, animated movies, virtual reality and the architecture of buildings.

During a construction project where one architect designs the geometry and another architect selects colours and materials, both architects can now work at the same time and can more easily collaborate on the project. Previously they have been forced to save the design in files which have been sent back and forth. To avoid extra work, often the same software package was used for all the tasks even if this package was not optimal for all the steps. Now the users can select the most appropriate Verse-enabled tool for each task and still combine them into a production pipeline. The architect can also get an idea of the acoustics in the building by using the Uni-Verse acoustic simulation module. Today this is usually done by an acoustic consultant working with a separate acoustic model of the building. With Uni-Verse the architect and the acoustic expert can work together with the same model and they can move a wall or change the material and directly get an idea of the result.

During SIGRAPH July 30 – August 3 the Uni-Verse project will be on display in the Open Source Pavilion and also organize a Birds of Feather Session on the Verse protocol.

“At SIGGRAPH this year we make the second release of the Uni-Verse tools including a modelling tool and a rendering tool specially designed for Verse” says Gert Svensson.

Verse connections for the largest commercial 3D tool Autodesk 3D Studio Max as well as largest open source tool Blender are also released.

Other Uni-Verse partners: Interactive Institute, Sweden, Fraunhofer IGD, Germany, Blender Foundation, Netherlands, Helsinki Technical University, Finland, Minusplus Architects in Hungary and Paregos a Swedish media design company.

Gert Svensson | alfa
Further information:

All articles from Information Technology >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: New 3-D wiring technique brings scalable quantum computers closer to reality

Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.

"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...

Im Focus: Scientists develop a semiconductor nanocomposite material that moves in response to light

In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.

A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...

Im Focus: Diamonds aren't forever: Sandia, Harvard team create first quantum computer bridge

By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.

"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...

Im Focus: New Products - Highlights of COMPAMED 2016

COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.

In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...

Im Focus: Ultra-thin ferroelectric material for next-generation electronics

'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.

Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...

All Focus news of the innovation-report >>>



Event News

#IC2S2: When Social Science meets Computer Science - GESIS will host the IC2S2 conference 2017

14.10.2016 | Event News

Agricultural Trade Developments and Potentials in Central Asia and the South Caucasus

14.10.2016 | Event News

World Health Summit – Day Three: A Call to Action

12.10.2016 | Event News

Latest News

Resolving the mystery of preeclampsia

21.10.2016 | Health and Medicine

Stanford researchers create new special-purpose computer that may someday save us billions

21.10.2016 | Information Technology

From ancient fossils to future cars

21.10.2016 | Materials Sciences

More VideoLinks >>>