Cuts Power Consumption and Footprint by One Third
Infineon Technologies AG (FSE/NYSE: IFX), a leading supplier of broadband access semiconductor solutions, today launched GEMINAX PRO, the industry’s highest-integration and lowest-power ADSL2+ chipset. Consisting of a 16-channel ADSL2+ Digital Front End (DFE) and a 4-channel Analog Front End (AFE), with integrated low-power Class D line drivers, the GEMINAX PRO chipset reduces power dissipation, footprint and overall system costs by up to 30 percent, in comparison to other chipsets currently available. Additionally, Remote Units (RUs) - typically constrained by power, area and battery back-up requirements - which incorporate the new Infineon chipset will also benefit from significant operational cost savings. Also, in environments where power dissipation values are restricted by standards, for example, the North American Network Equipment Building System (NEBS) standard, operators can now exploit real estate in the central office more efficiently.
High power dissipation of currently available ADSL2+ line drivers limits the integration to two channels per device. Infineon’s revolutionary switched-mode (“Class D”) line driver technology reduces the power dissipation of the line driver by 50 percent to less than 350 milliWatts per channel, allowing the integration of four line drivers and AFE channels into a single device. In contrast to ordinary linear devices available on the market, Class D devices use Pulse Width Modulation (PWM) technology to generate a higher efficiency analog signal that dramatically reduces power dissipation in the output stage. Class D amplifiers, widely used in audio applications, are restricted to low frequency range of few kiloHertz. On the other hand, ADSL2+ requires an operating bandwidth of 2.2 MHz. A multitude of technological innovations introduced by Infineon have made it possible to overcome this challenge without sacrificing performance.
Media Relations | Infineon Technologies AG
Stanford researchers create new special-purpose computer that may someday save us billions
21.10.2016 | Stanford University
New 3-D wiring technique brings scalable quantum computers closer to reality
19.10.2016 | University of Waterloo
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
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In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
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COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.
In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...
'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.
Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...
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