The German semiconductor manufacturer Infineon Technologies AG has introduced the world’s smallest and most economical chip for “ADSL2+” - the DSL data network of the future. This chip enables telecommunications companies to boost the number of super-high-speed DSL connections that they offer to their customers by approximately one third - without additional investments for cooling or for power supply and without changing cabinet sizes. With ADSL2+, which is expected to be launched as a service on a wide scale in 2006, a conventional telephone connection is sufficient to surf the Internet, receive multiple television channels and place a telephone call all at the same time.
“With the new semiconductor chip for future DSL central offices, Infineon Technologies is underscoring its leading role in the booming market for the chips that are being used in broadband data networks,” emphasizes Christian Wolff, Vice President Communications Business Group and General Manager Wireline Access Business Unit at Infineon. At the beginning of 2005, there were approximately 100 million DSL connections throughout the world. Approximately 40 percent of these connections were added last year. This growth is expected to continue over the next few years. In the process, the new ADSL2+ standard is to replace the current DSL connections soon. With ADSL2+, data can be transmitted at up to 25 megabits per second. This is approximately ten to twenty times faster than the DSL connections that are typically in use today, and it is sufficient to transmit several high-definition television broadcasts, Internet data and inexpensive Internet telephone calls simultaneously.
Less Heat – More Connections Within the Same Space
Media Relations | Infineon Technologies AG
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In recent years, lasers with ultrashort pulses (USP) down to the femtosecond range have become established on an industrial scale. They could advance some applications with the much-lauded “cold ablation” – if that meant they would then achieve more throughput. A new generation of process engineering that will address this issue in particular will be discussed at the “4th UKP Workshop – Ultrafast Laser Technology” in April 2017.
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A multi-institutional research collaboration has created a novel approach for fabricating three-dimensional micro-optics through the shape-defined formation of porous silicon (PSi), with broad impacts in integrated optoelectronics, imaging, and photovoltaics.
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The Max Planck Institute for Physics (MPP) is opening up a new research field. A workshop from November 21 - 22, 2016 will mark the start of activities for an innovative axion experiment. Axions are still only purely hypothetical particles. Their detection could solve two fundamental problems in particle physics: What dark matter consists of and why it has not yet been possible to directly observe a CP violation for the strong interaction.
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