Infineon Technologies (FSE/NYSE: IFX) and Clariant Corporation’s AZ Electronic Materials business (Somerville, N.J., USA) have signed an agreement to jointly develop photoresists for 157 nm exposure technology. The goal is to accelerate qualification of this technology for volume production.
The photoresist materials to be developed in this project will specifically enable Infineon to qualify the 157 nm technology for producing 55 nm structures in DRAM (dynamic random access memory) semiconductor chip production.
The International Technology Roadmap for Semiconductors, which describes the technology and materials needed for future chip generations, predicts that 55 nm structures will be in volume production beginning in 2007. One of the mainstream candidate technologies for achieving these dimensions is 157 nm lithography, a technology that uses fluorine molecular lasers emitting at the vacuum ultraviolet wavelength of 157 nm.
Fraunhofer FIT joins Facebook's Telecom Infra Project
25.10.2016 | Fraunhofer-Institut für Angewandte Informationstechnik FIT
Stanford researchers create new special-purpose computer that may someday save us billions
21.10.2016 | Stanford University
Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.
This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...
Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion
Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
27.10.2016 | Materials Sciences
27.10.2016 | Physics and Astronomy
27.10.2016 | Life Sciences