Infineon Technologies (FSE/NYSE: IFX) and Clariant Corporation’s AZ Electronic Materials business (Somerville, N.J., USA) have signed an agreement to jointly develop photoresists for 157 nm exposure technology. The goal is to accelerate qualification of this technology for volume production.
The photoresist materials to be developed in this project will specifically enable Infineon to qualify the 157 nm technology for producing 55 nm structures in DRAM (dynamic random access memory) semiconductor chip production.
The International Technology Roadmap for Semiconductors, which describes the technology and materials needed for future chip generations, predicts that 55 nm structures will be in volume production beginning in 2007. One of the mainstream candidate technologies for achieving these dimensions is 157 nm lithography, a technology that uses fluorine molecular lasers emitting at the vacuum ultraviolet wavelength of 157 nm.
TIB’s Visual Analytics Research Group to develop methods for person detection and visualisation
19.03.2018 | Technische Informationsbibliothek (TIB)
Green Light for Galaxy Europe
15.03.2018 | Albert-Ludwigs-Universität Freiburg im Breisgau
For the first time, an interdisciplinary team from the University of Basel has succeeded in integrating artificial organelles into the cells of live zebrafish embryos. This innovative approach using artificial organelles as cellular implants offers new potential in treating a range of diseases, as the authors report in an article published in Nature Communications.
In the cells of higher organisms, organelles such as the nucleus or mitochondria perform a range of complex functions necessary for life. In the networks of...
Animal photoreceptors capture light with photopigments. Researchers from the University of Göttingen have now discovered that these photopigments fulfill an...
On 15 March, the AWI research aeroplane Polar 5 will depart for Greenland. Concentrating on the furthest northeast region of the island, an international team...
The world’s second-largest ice shelf was the destination for a Polarstern expedition that ended in Punta Arenas, Chile on 14th March 2018. Oceanographers from...
At the 2018 ILA Berlin Air Show from April 25–29, the Fraunhofer Institute for Laser Technology ILT is showcasing extreme high-speed Laser Material Deposition (EHLA): A video documents how for metal components that are highly loaded, EHLA has already proved itself as an alternative to hard chrome plating, which is now allowed only under special conditions.
When the EU restricted the use of hexavalent chromium compounds to special applications requiring authorization, the move prompted a rethink in the surface...
19.03.2018 | Event News
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19.03.2018 | Physics and Astronomy
19.03.2018 | Materials Sciences
19.03.2018 | Event News