Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

Shrinking of Barrier Films into Nanotechnology Geometries

27.05.2003


Milestone to Fulfill Metallization Requirements for Chip Manufacturing into Next Decade




Infineon Technologies (FSE/NYSE: IFX) today announced that its Munich Research Labs have demonstrated, by shrinking present film thicknesses into nanotechnology geometries, that the stringent requirements of thin encapsulation films in metallization schemes of future chip generations will be met. The results shows that thin barrier films, key components for advanced copper chip wiring, will meet the electrical and functional demands defined for the end of the International Roadmap for Semiconductors (ITRS), which extends to 2016. The ITRS expects a reduction of the barrier thickness from 12nm (100nm node, 2003) to 2.5 nm (22 nm node, 2016). The goal of the Infineon researchers was to investigate the scaling limits of the current Ta /TaN barrier technology and its compatibility with the end-of-roadmap target values.

The Infineon researchers have successfully performed an electrical assessment of the integration of ultrathin metallic barrier films encapsulating copper metal lines in advanced chip metallization systems. These electrically conducting films separate the copper metal lines from the surrounding dielectrics used for electrical isolation. Hermetic encapsulation of copper lines has to prevent copper diffusion into the dielectric isolation, and in particular from reaching the transistors below the wiring layers in the chip, as at transistor level copper is readily destroying device operation.


To achieve best chip performance, these barrier films have to be processed as thin as possible for two reasons: Ultrathin barrier films around copper wires leave a maximum of space for the highly conducting copper wire. Furthermore, in the vertical interconnects between the layers of copper wires (via holes) the current flow crosses the barrier film. An ultrathin film provides a very low electrical resistance.

The obtained results demonstrated barrier functionality against copper diffusion with film thicknesses of less than 2 nanometers, meeting the same stringent reliability requirements as 50nm thick barrier films in a current semiconductor product. The electrical resistance of via holes with such thin barrier films is sufficiently low to realize such structures in high-speed microprocessor chips expected to come to production by the middle of next decade.

“ With its lower electrical resistance and its higher ruggedness against electro-migration copper shows clear advantages for high performance ICs. But to make this material usable as an interconnect material for future chip generations, great effort has to be spent on preventing any diffusion of copper,“ said Prof. Dr. Karl Joachim Ebeling, head of corporate research at Infineon Technologies. “The recent results mark a significant milestone to provide all the high sophisticated technologies needed to manufacture the further shrinked next chip generations.”

The manufacturing tools needed for the fabrication of chip generations in the timeframe beyond 2010 do not yet exist. Infineon overcame this issue by extending the unit processes in existing manufacturing tools far beyond the requirements in today’s products. This allows the reliable deposition of thin contiguous functional films with sub-2nm thicknesses as required in the metallization schemes for the generation of microprocessors which is expected to be in production not earlier than in 2016. The results therefore also demonstrate that the use of state-of-the-art thin film deposition techniques may be extended for future chip generations rather than requiring novel atomic layer deposition techniques.

The copper wires were fabricated with the damascene metallization technique. In this technique, grooves and holes are filled by deposition of metal followed by a complete removal of all metal covering the filled structures by chemical mechanical polishing. The technique is named after the way ornaments were once accomplished in damascene swords. The silicon wafers used for the electrical assessment of the embedded copper lines were processed with standard semiconductor manufacturing equipment and processes developed in Infineon´s Munich cleanrooms.

The results from Infineon’s Corporate Research demonstrate that thin barrier films will meet the requirements regarding electrical properties and functionality through the end of the ITRS in 2016. The ITRS describes the technological and material demands of future chip generations. Regarding the barrier films for the wiring schemes in end-of-roadmap chip generations the latest edition of the roadmap noted: “no manufacturable solution”. Infineon has demonstrated now, that this very thin barrier films are manufacturable, and it is expected that the next edition of the ITRS will be updated accordingly.

Reiner Schoenrock | Infineon Technologies AG
Further information:
http://www.infineon.com

More articles from Information Technology:

nachricht Underwater acoustic localization of marine mammals and vehicles
23.11.2017 | IMDEA Networks Institute

nachricht NASA CubeSat to test miniaturized weather satellite technology
10.11.2017 | NASA/Goddard Space Flight Center

All articles from Information Technology >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: New proton record: Researchers measure magnetic moment with greatest possible precision

High-precision measurement of the g-factor eleven times more precise than before / Results indicate a strong similarity between protons and antiprotons

The magnetic moment of an individual proton is inconceivably small, but can still be quantified. The basis for undertaking this measurement was laid over ten...

Im Focus: Frictional Heat Powers Hydrothermal Activity on Enceladus

Computer simulation shows how the icy moon heats water in a porous rock core

Heat from the friction of rocks caused by tidal forces could be the “engine” for the hydrothermal activity on Saturn's moon Enceladus. This presupposes that...

Im Focus: Nanoparticles help with malaria diagnosis – new rapid test in development

The WHO reports an estimated 429,000 malaria deaths each year. The disease mostly affects tropical and subtropical regions and in particular the African continent. The Fraunhofer Institute for Silicate Research ISC teamed up with the Fraunhofer Institute for Molecular Biology and Applied Ecology IME and the Institute of Tropical Medicine at the University of Tübingen for a new test method to detect malaria parasites in blood. The idea of the research project “NanoFRET” is to develop a highly sensitive and reliable rapid diagnostic test so that patient treatment can begin as early as possible.

Malaria is caused by parasites transmitted by mosquito bite. The most dangerous form of malaria is malaria tropica. Left untreated, it is fatal in most cases....

Im Focus: A “cosmic snake” reveals the structure of remote galaxies

The formation of stars in distant galaxies is still largely unexplored. For the first time, astron-omers at the University of Geneva have now been able to closely observe a star system six billion light-years away. In doing so, they are confirming earlier simulations made by the University of Zurich. One special effect is made possible by the multiple reflections of images that run through the cosmos like a snake.

Today, astronomers have a pretty accurate idea of how stars were formed in the recent cosmic past. But do these laws also apply to older galaxies? For around a...

Im Focus: Visual intelligence is not the same as IQ

Just because someone is smart and well-motivated doesn't mean he or she can learn the visual skills needed to excel at tasks like matching fingerprints, interpreting medical X-rays, keeping track of aircraft on radar displays or forensic face matching.

That is the implication of a new study which shows for the first time that there is a broad range of differences in people's visual ability and that these...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

Ecology Across Borders: International conference brings together 1,500 ecologists

15.11.2017 | Event News

Road into laboratory: Users discuss biaxial fatigue-testing for car and truck wheel

15.11.2017 | Event News

#Berlin5GWeek: The right network for Industry 4.0

30.10.2017 | Event News

 
Latest News

IceCube experiment finds Earth can block high-energy particles from nuclear reactions

24.11.2017 | Physics and Astronomy

A 'half-hearted' solution to one-sided heart failure

24.11.2017 | Health and Medicine

Heidelberg Researchers Study Unique Underwater Stalactites

24.11.2017 | Earth Sciences

VideoLinks
B2B-VideoLinks
More VideoLinks >>>