Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

MEDEA+ Noblanc award highlights improvements in microelectronics applications security and chip-production technology

04.03.2008
Two projects – ONOM@TOPIC and SilOnIS – shared the 2007 Jean-Pierre Noblanc Award for Excellence for the most innovative and sustainable project in the EUREKA MEDEA+ microelectronics Cluster.

ONOM@TOPIC+ developed a European smartcard platform for citizenship and mobile multimedia applications that makes life easier and more secure for users while adding value for network operators. SilOnIS combines strained silicon and silicon-oninsulator (SOI) technologies in a single platform for high-performance chips that will speed their introduction into full scale production in Europe.

Smart approach secures e-services

Identity validation, security and privacy are crucial in the modern connected world. Increased integration means smartcards containing a microprocessor and embedded memory can now offer secure interoperability across Europe, simplifying citizen access to fixed and mobile eservices and multimedia content. ONOM@TOPIC+ developed complete hardware and embedded software platforms enabling citizens to benefit from the enormous potential of eservices offered by public authorities and business. The MEDEA+ project developed card-embedded and middleware-oriented functions that make possible deployment of next generation European citizenship cards as well as preparing interoperability between European and worldwide identity projects.

As a result, citizens will be able to carry a smartcard providing access to healthcare, administrative, government and private services such as banking and multimedia entertainment in other countries as the card will be recognised and mechanisms interoperable. ‘We developed new mechanisms to gain knowledge of which services can be hosted on the card, how these services can be accessed and how communication can be established in an efficient way between card and remote server without compromising security for card issuer or user,’ says Jean-Pierre Tual of project coordinator Gemalto.

‘We also studied interoperability between major countries in Europe already in agreement on such a scheme. Some identity projects will be industrialised within two years.’ The project involved all key players from the European smartcard and mobile industries: smartcard manufacturers, chipmakers, handset manufacturers, mobile operators, electronic design companies, biometrics specialists, software development/verification tool companies, security laboratories, services companies and universities.

EUREKA labelling was important because the project was industrially-led with short- to mid-term expectations. ‘We had a strong consortium and knew there could be sharp changes in strategy dictated by the market or by the partners, so we needed flexibility,’ adds Tual. ‘EUREKA provides this type of key and decisive advantage.’

Advanced substrates boost chip performance

Silicon substrates are key to modern electronics components. However, as chips become ever smaller, plain silicon no longer provides the performance necessary. Development of a single platform combining the benefits of strained silicon and SOI substrate technologies in SilOnIS offers much improved performance for future chip generations, boosting the speed at which electronic messages can be transferred while reducing the energy required. Suitable wafers should be available commercially in 2008 for fabrication of devices at the 45-nm half-pitch node and below in line with global industry needs.

‘Close collaboration between advanced substrate manufacturers and chipmakers was essential to match the developments in the two complementary fields,’ says Bruno Ghyselen of project leader SOITEC. ‘Carrying out such a collaborative project in the framework of EUREKA brought additional benefits; sharing the risks and the financing was a real enabler to undertake such an innovative and high risk project. And success ensures a strategic advantage for Europe in terms of substrate technology.’ European substrate suppliers have been able to reinforce their leading position in the high added-value segment of engineered substrates while counterbalancing Japanese leadership in bulk silicon.

Chipmakers have gained early access to innovative solutions that will strengthen Europe’s position in low power and high-performance components. And several metrology and characterisation equipment suppliers have been able to develop specific metrology or specific ways of using standard metrology for this key area.

Sally Horspool | alfa
Further information:
http://www.eureka.be

More articles from Information Technology:

nachricht Ultra-precise chip-scale sensor detects unprecedentedly small changes at the nanoscale
18.01.2017 | The Hebrew University of Jerusalem

nachricht Data analysis optimizes cyber-physical systems in telecommunications and building automation
18.01.2017 | Fraunhofer-Institut für Algorithmen und Wissenschaftliches Rechnen SCAI

All articles from Information Technology >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: How gut bacteria can make us ill

HZI researchers decipher infection mechanisms of Yersinia and immune responses of the host

Yersiniae cause severe intestinal infections. Studies using Yersinia pseudotuberculosis as a model organism aim to elucidate the infection mechanisms of these...

Im Focus: Interfacial Superconductivity: Magnetic and superconducting order revealed simultaneously

Researchers from the University of Hamburg in Germany, in collaboration with colleagues from the University of Aarhus in Denmark, have synthesized a new superconducting material by growing a few layers of an antiferromagnetic transition-metal chalcogenide on a bismuth-based topological insulator, both being non-superconducting materials.

While superconductivity and magnetism are generally believed to be mutually exclusive, surprisingly, in this new material, superconducting correlations...

Im Focus: Studying fundamental particles in materials

Laser-driving of semimetals allows creating novel quasiparticle states within condensed matter systems and switching between different states on ultrafast time scales

Studying properties of fundamental particles in condensed matter systems is a promising approach to quantum field theory. Quasiparticles offer the opportunity...

Im Focus: Designing Architecture with Solar Building Envelopes

Among the general public, solar thermal energy is currently associated with dark blue, rectangular collectors on building roofs. Technologies are needed for aesthetically high quality architecture which offer the architect more room for manoeuvre when it comes to low- and plus-energy buildings. With the “ArKol” project, researchers at Fraunhofer ISE together with partners are currently developing two façade collectors for solar thermal energy generation, which permit a high degree of design flexibility: a strip collector for opaque façade sections and a solar thermal blind for transparent sections. The current state of the two developments will be presented at the BAU 2017 trade fair.

As part of the “ArKol – development of architecturally highly integrated façade collectors with heat pipes” project, Fraunhofer ISE together with its partners...

Im Focus: How to inflate a hardened concrete shell with a weight of 80 t

At TU Wien, an alternative for resource intensive formwork for the construction of concrete domes was developed. It is now used in a test dome for the Austrian Federal Railways Infrastructure (ÖBB Infrastruktur).

Concrete shells are efficient structures, but not very resource efficient. The formwork for the construction of concrete domes alone requires a high amount of...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

12V, 48V, high-voltage – trends in E/E automotive architecture

10.01.2017 | Event News

2nd Conference on Non-Textual Information on 10 and 11 May 2017 in Hannover

09.01.2017 | Event News

Nothing will happen without batteries making it happen!

05.01.2017 | Event News

 
Latest News

A big nano boost for solar cells

18.01.2017 | Power and Electrical Engineering

Glass's off-kilter harmonies

18.01.2017 | Materials Sciences

Toward a 'smart' patch that automatically delivers insulin when needed

18.01.2017 | Life Sciences

VideoLinks
B2B-VideoLinks
More VideoLinks >>>