ONOM@TOPIC+ developed a European smartcard platform for citizenship and mobile multimedia applications that makes life easier and more secure for users while adding value for network operators. SilOnIS combines strained silicon and silicon-oninsulator (SOI) technologies in a single platform for high-performance chips that will speed their introduction into full scale production in Europe.
Smart approach secures e-services
Identity validation, security and privacy are crucial in the modern connected world. Increased integration means smartcards containing a microprocessor and embedded memory can now offer secure interoperability across Europe, simplifying citizen access to fixed and mobile eservices and multimedia content. ONOM@TOPIC+ developed complete hardware and embedded software platforms enabling citizens to benefit from the enormous potential of eservices offered by public authorities and business. The MEDEA+ project developed card-embedded and middleware-oriented functions that make possible deployment of next generation European citizenship cards as well as preparing interoperability between European and worldwide identity projects.
As a result, citizens will be able to carry a smartcard providing access to healthcare, administrative, government and private services such as banking and multimedia entertainment in other countries as the card will be recognised and mechanisms interoperable. ‘We developed new mechanisms to gain knowledge of which services can be hosted on the card, how these services can be accessed and how communication can be established in an efficient way between card and remote server without compromising security for card issuer or user,’ says Jean-Pierre Tual of project coordinator Gemalto.
‘We also studied interoperability between major countries in Europe already in agreement on such a scheme. Some identity projects will be industrialised within two years.’ The project involved all key players from the European smartcard and mobile industries: smartcard manufacturers, chipmakers, handset manufacturers, mobile operators, electronic design companies, biometrics specialists, software development/verification tool companies, security laboratories, services companies and universities.
EUREKA labelling was important because the project was industrially-led with short- to mid-term expectations. ‘We had a strong consortium and knew there could be sharp changes in strategy dictated by the market or by the partners, so we needed flexibility,’ adds Tual. ‘EUREKA provides this type of key and decisive advantage.’
Advanced substrates boost chip performance
Silicon substrates are key to modern electronics components. However, as chips become ever smaller, plain silicon no longer provides the performance necessary. Development of a single platform combining the benefits of strained silicon and SOI substrate technologies in SilOnIS offers much improved performance for future chip generations, boosting the speed at which electronic messages can be transferred while reducing the energy required. Suitable wafers should be available commercially in 2008 for fabrication of devices at the 45-nm half-pitch node and below in line with global industry needs.
‘Close collaboration between advanced substrate manufacturers and chipmakers was essential to match the developments in the two complementary fields,’ says Bruno Ghyselen of project leader SOITEC. ‘Carrying out such a collaborative project in the framework of EUREKA brought additional benefits; sharing the risks and the financing was a real enabler to undertake such an innovative and high risk project. And success ensures a strategic advantage for Europe in terms of substrate technology.’ European substrate suppliers have been able to reinforce their leading position in the high added-value segment of engineered substrates while counterbalancing Japanese leadership in bulk silicon.
Chipmakers have gained early access to innovative solutions that will strengthen Europe’s position in low power and high-performance components. And several metrology and characterisation equipment suppliers have been able to develop specific metrology or specific ways of using standard metrology for this key area.
Sally Horspool | alfa
Supercomputing the emergence of material behavior
18.05.2018 | University of Texas at Austin, Texas Advanced Computing Center
Keeping a Close Eye on Ice Loss
18.05.2018 | Alfred-Wegener-Institut, Helmholtz-Zentrum für Polar- und Meeresforschung
A research team led by physicists at the Technical University of Munich (TUM) has developed molecular nanoswitches that can be toggled between two structurally different states using an applied voltage. They can serve as the basis for a pioneering class of devices that could replace silicon-based components with organic molecules.
The development of new electronic technologies drives the incessant reduction of functional component sizes. In the context of an international collaborative...
At the LASYS 2018, from June 5th to 7th, the Laser Zentrum Hannover e.V. (LZH) will be showcasing processes for the laser material processing of tomorrow in hall 4 at stand 4E75. With blown bomb shells the LZH will present first results of a research project on civil security.
At this year's LASYS, the LZH will exhibit light-based processes such as cutting, welding, ablation and structuring as well as additive manufacturing for...
There are videos on the internet that can make one marvel at technology. For example, a smartphone is casually bent around the arm or a thin-film display is rolled in all directions and with almost every diameter. From the user's point of view, this looks fantastic. From a professional point of view, however, the question arises: Is that already possible?
At Display Week 2018, scientists from the Fraunhofer Institute for Applied Polymer Research IAP will be demonstrating today’s technological possibilities and...
So-called quantum many-body scars allow quantum systems to stay out of equilibrium much longer, explaining experiment | Study published in Nature Physics
Recently, researchers from Harvard and MIT succeeded in trapping a record 53 atoms and individually controlling their quantum state, realizing what is called a...
The historic first detection of gravitational waves from colliding black holes far outside our galaxy opened a new window to understanding the universe. A...
02.05.2018 | Event News
13.04.2018 | Event News
12.04.2018 | Event News
24.05.2018 | Ecology, The Environment and Conservation
24.05.2018 | Medical Engineering
24.05.2018 | Physics and Astronomy