Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

Optoelectronics: Tapering off for efficiency

14.09.2015

A new compact structure enables efficient lasers to be realized on silicon chips

A compact ‘on-silicon-chip’ laser has been developed by researchers at Agency for Science, Technology and Research (A*STAR) in Singapore that boasts both excellent confinement of light for lasing and the ability to efficiently share the laser light with nearby components.


A new design for a compact on-chip laser showing the two tapered ends that allow light to be efficiently coupled with structures on the chip. © 2015 A*STAR Data Storage Institute

Compact lasers small enough to be integrated on chips are in great demand for a diverse range of applications, including data communication and storage. Lasers made from a combination of silicon and semiconductors containing elements from the third and fifth columns in the periodic table (dubbed III–V silicon lasers) are particularly attractive as on-chip light sources.

To be used in applications, such lasers must tightly confine light to maximize the lasing efficiency and should effectively share, or ‘couple’, light with optical waveguides — the optical equivalent of electrical wiring — located under the laser.

Jing Pu and co-workers at the A*STAR Data Storage Institute have demonstrated a III–V silicon laser that meets both criteria. Their structure realizes efficient lasing through the smart control of light — light is tightly confined to the III–V semiconductor layer in which lasing occurs. Furthermore, both laser ends are tapered to facilitate the coupling of light with underlying silicon waveguides.

“Our laser exhibits a high efficiency as well as efficient light coupling between the III–V semiconductor and silicon layers, which is the thinnest reported to date,” says Pu.

The new structure is promising as an on-chip light source for current silicon photonics technology but also as a potential new integration platform. It improves on conventional fabrication procedures, in which components are made separately and then combined, and enables fully integrated optoelectronic systems to be fabricated that take up less space on a chip.

“This new technology could replace the current approach of integrating a laser diode to an optical system through assembling and then bonding of components,” explains Pu. “The laser diodes can be fabricated exactly where they are needed, which will cut the manufacturing cost and reduce the size and weight of light sources by a factor of hundreds.”

These advantages are very attractive for many applications, including next-generation high-density magnetic data storage, where laser diodes need to be integrated on writing heads that are smaller than 0.1 square millimeters.

The team plans to improve the manufacturing process and device performance so that the technology can advance from prototype to manufacture for industrial applications. “We also aim to reduce the laser size and power consumption for use as vital components for high-performance computing,” Pu adds.

The A*STAR-affiliated researchers contributing to this research are from the Data Storage Institute. More information about the group’s research can be found at the Nanotechnology Integration Group webpage.

Reference

Pu, J., Lim, K. P., Ng, D. K. T., Krishnamurthy, V., Lee, C. W., Tang, K. et al. Heterogeneously integrated III-V laser on thin SOI with compact optical vertical interconnect access. Optics Letters 40, 1378–1381 (2015).


Associated links
Original article from A*STAR Research

A*STAR Research | ResearchSea
Further information:
http://www.researchsea.com

More articles from Information Technology:

nachricht Ultra-precise chip-scale sensor detects unprecedentedly small changes at the nanoscale
18.01.2017 | The Hebrew University of Jerusalem

nachricht Data analysis optimizes cyber-physical systems in telecommunications and building automation
18.01.2017 | Fraunhofer-Institut für Algorithmen und Wissenschaftliches Rechnen SCAI

All articles from Information Technology >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: How gut bacteria can make us ill

HZI researchers decipher infection mechanisms of Yersinia and immune responses of the host

Yersiniae cause severe intestinal infections. Studies using Yersinia pseudotuberculosis as a model organism aim to elucidate the infection mechanisms of these...

Im Focus: Interfacial Superconductivity: Magnetic and superconducting order revealed simultaneously

Researchers from the University of Hamburg in Germany, in collaboration with colleagues from the University of Aarhus in Denmark, have synthesized a new superconducting material by growing a few layers of an antiferromagnetic transition-metal chalcogenide on a bismuth-based topological insulator, both being non-superconducting materials.

While superconductivity and magnetism are generally believed to be mutually exclusive, surprisingly, in this new material, superconducting correlations...

Im Focus: Studying fundamental particles in materials

Laser-driving of semimetals allows creating novel quasiparticle states within condensed matter systems and switching between different states on ultrafast time scales

Studying properties of fundamental particles in condensed matter systems is a promising approach to quantum field theory. Quasiparticles offer the opportunity...

Im Focus: Designing Architecture with Solar Building Envelopes

Among the general public, solar thermal energy is currently associated with dark blue, rectangular collectors on building roofs. Technologies are needed for aesthetically high quality architecture which offer the architect more room for manoeuvre when it comes to low- and plus-energy buildings. With the “ArKol” project, researchers at Fraunhofer ISE together with partners are currently developing two façade collectors for solar thermal energy generation, which permit a high degree of design flexibility: a strip collector for opaque façade sections and a solar thermal blind for transparent sections. The current state of the two developments will be presented at the BAU 2017 trade fair.

As part of the “ArKol – development of architecturally highly integrated façade collectors with heat pipes” project, Fraunhofer ISE together with its partners...

Im Focus: How to inflate a hardened concrete shell with a weight of 80 t

At TU Wien, an alternative for resource intensive formwork for the construction of concrete domes was developed. It is now used in a test dome for the Austrian Federal Railways Infrastructure (ÖBB Infrastruktur).

Concrete shells are efficient structures, but not very resource efficient. The formwork for the construction of concrete domes alone requires a high amount of...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

12V, 48V, high-voltage – trends in E/E automotive architecture

10.01.2017 | Event News

2nd Conference on Non-Textual Information on 10 and 11 May 2017 in Hannover

09.01.2017 | Event News

Nothing will happen without batteries making it happen!

05.01.2017 | Event News

 
Latest News

A big nano boost for solar cells

18.01.2017 | Power and Electrical Engineering

Glass's off-kilter harmonies

18.01.2017 | Materials Sciences

Toward a 'smart' patch that automatically delivers insulin when needed

18.01.2017 | Life Sciences

VideoLinks
B2B-VideoLinks
More VideoLinks >>>