Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:


Electronic mandates for SEPA direct debit transactions

Comparative study of SEPA-compliant solutions

The migration to the SEPA payment instruments in February 2014 poses new challenges to payment service providers and users.

From that date on, a creditor needs to be in possession of a mandate signed by the debtor in order to collect direct debit payments. Fraunhofer IAO has conducted a comparative study of solutions for SEPA-compliant electronic mandates with regard to the advantages and disadvantages for debtors, creditors, and banks.

Until now, direct debit has been the payment method of choice for many payers and payees, especially in Germany. This method is appreciated by all parties for its convenience, and especially the simplicity of setting up direct debit arrangements. As of February 2014, banks and payees (creditors) must adapt their direct debit processes to the requirements of the SEPA Direct Debit (SDD) Schemes.

Among other things, the payer (debtor) needs to sign a SEPA-compliant mandate to give his or her consent to a one-off or recurrent direct debit. Given the increasingly widespread use of electronic payment orders, there is a need for suitable electronic mandate solutions that provide the required security while being easy to implement.

This is the subject of Fraunhofer IAO’s white paper entitled “Electronic Mandates for SEPA Direct Debit Transactions”. The white paper was produced with the financial support of EBA CLEARING, the provider of the electronic authorisation solution MyBank. The study looks at various alternative forms of electronic mandates and evaluates their advantages and limitations. The white paper compares the following alternatives:

E-mandate solutions based on the 2-corner model, which include processing by the debtor and the creditor only;
E-mandate solutions based on the 3-corner model, which additionally include processing by the debtor’s bank;
E-mandate solutions based on the 4-corner model, which additionally include processing by both the debtor’s and the creditor’s bank.

The white paper provides service providers, payees and technical providers with an overview of the system security, user-friendliness, and practicability of the different solutions.

The document is available in English and German and can be downloaded free of charge by clicking on the following link:

Maximilien Kintz
Electronic Business
Fraunhofer IAO
Nobelstraße 12
70569 Stuttgart, Germany
Telefon +49 711 970-2182

Juliane Segedi | Fraunhofer-Institut
Further information:

Further reports about: E-mandate Electronic Systems SEPA SEPA-compliant service provider

More articles from Information Technology:

nachricht Fraunhofer FIT joins Facebook's Telecom Infra Project
25.10.2016 | Fraunhofer-Institut für Angewandte Informationstechnik FIT

nachricht Stanford researchers create new special-purpose computer that may someday save us billions
21.10.2016 | Stanford University

All articles from Information Technology >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Etching Microstructures with Lasers

Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.

This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...

Im Focus: Light-driven atomic rotations excite magnetic waves

Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion

Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...

Im Focus: New 3-D wiring technique brings scalable quantum computers closer to reality

Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.

"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...

Im Focus: Scientists develop a semiconductor nanocomposite material that moves in response to light

In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.

A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...

Im Focus: Diamonds aren't forever: Sandia, Harvard team create first quantum computer bridge

By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.

"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...

All Focus news of the innovation-report >>>



Event News

#IC2S2: When Social Science meets Computer Science - GESIS will host the IC2S2 conference 2017

14.10.2016 | Event News

Agricultural Trade Developments and Potentials in Central Asia and the South Caucasus

14.10.2016 | Event News

World Health Summit – Day Three: A Call to Action

12.10.2016 | Event News

Latest News

Ice shelf vibrations cause unusual waves in Antarctic atmosphere

25.10.2016 | Earth Sciences

Fluorescent holography: Upending the world of biological imaging

25.10.2016 | Power and Electrical Engineering

Etching Microstructures with Lasers

25.10.2016 | Process Engineering

More VideoLinks >>>