Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

First 3-D processor runs at 1.4 Ghz on new architecture

16.09.2008
'Rochester Cube' points way to more powerful chip designs

The next major advance in computer processors will likely be the move from today's two-dimensional chips to three-dimensional circuits, and the first three-dimensional synchronization circuitry is now running at 1.4 gigahertz at the University of Rochester.

Unlike past attempts at 3-D chips, the Rochester chip is not simply a number of regular processors stacked on top of one another. It was designed and built specifically to optimize all key processing functions vertically, through multiple layers of processors, the same way ordinary chips optimize functions horizontally. The design means tasks such as synchronicity, power distribution, and long-distance signaling are all fully functioning in three dimensions for the first time.

"I call it a cube now, because it's not just a chip anymore," says Eby Friedman, Distinguished Professor of Electrical and Computer Engineering at Rochester and faculty director of the pro of the processor. "This is the way computing is going to have to be done in the future. When the chips are flush against each other, they can do things you could never do with a regular 2-D chip."

Friedman, working with engineering student Vasilis Pavlidis, says that many in the integrated circuit industry are talking about the limits of miniaturization, a point at which it will be impossible to pack more chips next to each other and thus limit the capabilities of future processors'. He says a number of integrated circuit designers anticipate someday expanding into the third dimension, stacking transistors on top of each other.

But with vertical expansion will come a host of difficulties, and Friedman says the key is to design a 3-D chip where all the layers interact like a single system. Friedman says getting all three levels of the 3-D chip to act in harmony is like trying to devise a traffic control system for the entire United States—and then layering two more United States above the first and somehow getting every bit of traffic from any point on any level to its destination on any other level—while simultaneously coordinating the traffic of millions of other drivers.

Complicate that by changing the two United States layers to something like China and India where the driving laws and roads are quite different, and the complexity and challenge of designing a single control system to work in any chip begins to become apparent, says Friedman.

Since each layer could be a different processor with a different function, such as converting MP3 files to audio or detecting light for a digital camera, Friedman says that the 3-D chip is essentially an entire circuit board folded up into a tiny package. He says the chips inside something like an iPod could be compacted to a tenth their current size with ten times the speed.

What makes it all possible is the architecture Friedman and his students designed, which uses many of the tricks of regular processors, but also accounts for different impedances that might occur from chip to chip, different operating speeds, and different power requirements. The fabrication of the chip is unique as well. Manufactured at MIT, the chip must have millions of holes drilled into the insulation that separates the layers in order to allow for the myriad vertical connections between transistors in different layers.

"Are we going to hit a point where we can't scale integrated circuits any smaller? Horizontally, yes," says Friedman. "But we're going to start scaling vertically, and that will never end. At least not in my lifetime. Talk to my grandchildren about that."

The next major advance in computer processors will likely be the move from today's two-dimensional chips to three-dimensional circuits, and the first three-dimensional synchronization circuitry is now running at 1.4 gigahertz at the University of Rochester.

Unlike past attempts at 3-D chips, the Rochester chip is not simply a number of regular processors stacked on top of one another. It was designed and built specifically to optimize all key processing functions vertically, through multiple layers of processors, the same way ordinary chips optimize functions horizontally. The design means tasks such as synchronicity, power distribution, and long-distance signaling are all fully functioning in three dimensions for the first time.

"I call it a cube now, because it's not just a chip anymore," says Eby Friedman, Distinguished Professor of Electrical and Computer Engineering at Rochester and faculty director of the pro of the processor. "This is the way computing is going to have to be done in the future. When the chips are flush against each other, they can do things you could never do with a regular 2-D chip."

Friedman, working with engineering student Vasilis Pavlidis, says that many in the integrated circuit industry are talking about the limits of miniaturization, a point at which it will be impossible to pack more chips next to each other and thus limit the capabilities of future processors'. He says a number of integrated circuit designers anticipate someday expanding into the third dimension, stacking transistors on top of each other.

But with vertical expansion will come a host of difficulties, and Friedman says the key is to design a 3-D chip where all the layers interact like a single system. Friedman says getting all three levels of the 3-D chip to act in harmony is like trying to devise a traffic control system for the entire United States—and then layering two more United States above the first and somehow getting every bit of traffic from any point on any level to its destination on any other level—while simultaneously coordinating the traffic of millions of other drivers.

Complicate that by changing the two United States layers to something like China and India where the driving laws and roads are quite different, and the complexity and challenge of designing a single control system to work in any chip begins to become apparent, says Friedman.

Since each layer could be a different processor with a different function, such as converting MP3 files to audio or detecting light for a digital camera, Friedman says that the 3-D chip is essentially an entire circuit board folded up into a tiny package. He says the chips inside something like an iPod could be compacted to a tenth their current size with ten times the speed.

What makes it all possible is the architecture Friedman and his students designed, which uses many of the tricks of regular processors, but also accounts for different impedances that might occur from chip to chip, different operating speeds, and different power requirements. The fabrication of the chip is unique as well. Manufactured at MIT, the chip must have millions of holes drilled into the insulation that separates the layers in order to allow for the myriad vertical connections between transistors in different layers.

"Are we going to hit a point where we can't scale integrated circuits any smaller? Horizontally, yes," says Friedman. "But we're going to start scaling vertically, and that will never end. At least not in my lifetime. Talk to my grandchildren about that."

Jonathan Sherwood | EurekAlert!
Further information:
http://www.rochester.edu

Further reports about: 3-D chips 3-D processor MP3 MP3 files control system digital camera traffic control

More articles from Information Technology:

nachricht The TU Ilmenau develops tomorrow’s chip technology today
27.04.2017 | Technische Universität Ilmenau

nachricht Five developments for improved data exploitation
19.04.2017 | Deutsches Forschungszentrum für Künstliche Intelligenz GmbH, DFKI

All articles from Information Technology >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Making lightweight construction suitable for series production

More and more automobile companies are focusing on body parts made of carbon fiber reinforced plastics (CFRP). However, manufacturing and repair costs must be further reduced in order to make CFRP more economical in use. Together with the Volkswagen AG and five other partners in the project HolQueSt 3D, the Laser Zentrum Hannover e.V. (LZH) has developed laser processes for the automatic trimming, drilling and repair of three-dimensional components.

Automated manufacturing processes are the basis for ultimately establishing the series production of CFRP components. In the project HolQueSt 3D, the LZH has...

Im Focus: Wonder material? Novel nanotube structure strengthens thin films for flexible electronics

Reflecting the structure of composites found in nature and the ancient world, researchers at the University of Illinois at Urbana-Champaign have synthesized thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about fifty times higher than copper films, currently used in electronics.

"The structural robustness of thin metal films has significant importance for the reliable operation of smart skin and flexible electronics including...

Im Focus: Deep inside Galaxy M87

The nearby, giant radio galaxy M87 hosts a supermassive black hole (BH) and is well-known for its bright jet dominating the spectrum over ten orders of magnitude in frequency. Due to its proximity, jet prominence, and the large black hole mass, M87 is the best laboratory for investigating the formation, acceleration, and collimation of relativistic jets. A research team led by Silke Britzen from the Max Planck Institute for Radio Astronomy in Bonn, Germany, has found strong indication for turbulent processes connecting the accretion disk and the jet of that galaxy providing insights into the longstanding problem of the origin of astrophysical jets.

Supermassive black holes form some of the most enigmatic phenomena in astrophysics. Their enormous energy output is supposed to be generated by the...

Im Focus: A Quantum Low Pass for Photons

Physicists in Garching observe novel quantum effect that limits the number of emitted photons.

The probability to find a certain number of photons inside a laser pulse usually corresponds to a classical distribution of independent events, the so-called...

Im Focus: Microprocessors based on a layer of just three atoms

Microprocessors based on atomically thin materials hold the promise of the evolution of traditional processors as well as new applications in the field of flexible electronics. Now, a TU Wien research team led by Thomas Müller has made a breakthrough in this field as part of an ongoing research project.

Two-dimensional materials, or 2D materials for short, are extremely versatile, although – or often more precisely because – they are made up of just one or a...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

Expert meeting “Health Business Connect” will connect international medical technology companies

20.04.2017 | Event News

Wenn der Computer das Gehirn austrickst

18.04.2017 | Event News

7th International Conference on Crystalline Silicon Photovoltaics in Freiburg on April 3-5, 2017

03.04.2017 | Event News

 
Latest News

Bare bones: Making bones transparent

27.04.2017 | Life Sciences

Study offers new theoretical approach to describing non-equilibrium phase transitions

27.04.2017 | Physics and Astronomy

From volcano's slope, NASA instrument looks sky high and to the future

27.04.2017 | Earth Sciences

VideoLinks
B2B-VideoLinks
More VideoLinks >>>