The new product from the 170 family of panels is notable for its compact format and a visualization screen that is one third larger than that of comparable devices on the market. The LED backlighting of the display can be dimmed to 20 % of its normal brightness and can be switched off completely by means of the integrated screensaver.
The Simatic HMI TP 177B 4“ also features interfaces for Profibus DP and Profinet IO, as well as terminals for connecting mobile data carriers such as USB sticks, SD cards or MMC cards. The operator can use these to create a backup of configurations, programs or recipe data, for example. The new panel is configured with the aid of the "Simatic WinCC flexible 2008" engineering software.
The Siemens Industry Sector (Erlangen, Germany) is the worldwide leading supplier of production, transportation and building technologies. With integrated hardware and software technologies as well as comprehensive Industry-specific solutions, Siemens increases the productivity and efficiency of its customers in the fields of industry and infrastructure. The Sector consists of six divisions: Building Technologies, Industry Automation, Industry Solutions, Mobility, Drive Technologies and Osram. With around 209,000 employees worldwide Siemens Industry achieved in fiscal 2007 total sales of approximately EUR40 billion (pro forma, unconsolidated).
The Siemens Industry Automation Division (Nuremberg, Germany) is a worldwide leader in the fields of automation systems, low-voltage switchgear and industrial software. Its portfolio ranges from standard products for the manufacturing and process industries to solutions for whole industrial sectors that encompass the automation of entire automobile production facilities and chemical plants. As a leading software supplier, Industry Automation optimizes the entire value added chain of manufacturers – from product design and development to production, sales and a wide range of maintenance services.
Process-Integrated Inspection for Ultrasound-Supported Friction Stir Welding of Metal Hybrid-Joints
27.09.2016 | Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP
Lightweight robots in manual assembly
13.09.2016 | Fraunhofer-Institut für Arbeitswirtschaft und Organisation IAO
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.
In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...
'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.
Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
21.10.2016 | Health and Medicine
21.10.2016 | Information Technology
21.10.2016 | Materials Sciences