Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:


More performance and expanded functions for mid-range and high-range controllers

The Siemens Industry Automation Division has expanded its portfolio of mid-range and high-range S7-300 and S7-400 Simatic controllers and improved their performance.

A new firmware, with Profinet functions such as isochronous mode, I Device, Shared Device and Media Redundancy Protocol, and an integrated web server expand the functionality and application fields of the controllers significantly. In addition, the S7-400 controller family has been supplemented by the new CPU 412-2 PN/DP for the lower performance segment. On the Simatic S7-300 the working memory and performance of the CPU 319-3 PN/DP have been increased.

The upgraded CPU 319-3 PN/DP of the Simatic S7-300 controllers now has considerably more working memory and performance than its predecessor version. Equipped with two Profinet ports and a working memory of 2 megabytes (2.5 megabytes in the fail-safe version), the CPU now achieves a bit processing time of four nanoseconds, i.e. a computing speed that is two and a half times faster. The new CPU 412-2 PN/DP for the Simatic S7-400 controllers is provided with a variety of communication functions and is designed for the lower performance segment. Furthermore, the working memory capacity of the CPUs 414 and 416 has been increased.

The new firmware V 3.2 for the S7-300 controllers and V 6.0 for S7-400 controllers provide enhanced options in system design and simplified maintenance and diagnostics functions. The firmware incorporates the Profinet functions isochronous mode, I Device, Shared Device and Media Redundancy Protocol, as well as a web server with user-definable web pages. The new firmware is available for the Profinet controllers CPU 319-3 PN/DP, 315/317-2 PN/DP and their fail-safe variants CPU 315F-2 PN/DP and CPU 317F-2 PN/DP, as well as for the new S7-400 controllers CPU 412-2 PN/DP and the CPUs 414/416-3 PN/DP.

The Siemens Industry Sector (Erlangen, Germany) is the worldwide leading supplier of environmentally friendly production, transportation, building and lighting technologies. With integrated automation technologies and comprehensive industry-specific solutions, Siemens increases the productivity, efficiency and flexibility of its customers in the fields of industry and infrastructure. The Sector consists of six divisions: Building Technologies, Drive Technologies, Industry Automation, Industry Solutions, Mobility and Osram. With around 207,000 employees worldwide (September 30), Siemens Industry achieved in fiscal year 2009 total sales of approximately €35 billion.

The Siemens Industry Automation Division (Nuremberg, Germany) is a worldwide leader in the fields of automation systems, industrial controls and industrial software. Its portfolio ranges from standard products for the manufacturing and process industries to solutions for whole industrial sectors that encompass the automation of entire automobile production facilities and chemical plants. As a leading software supplier, Industry Automation optimizes the entire value added chain of manufacturers – from product design and development to production, sales and a wide range of maintenance services. With around 39,000 employees worldwide (September 30), Siemens Industry Automation achieved sales of €7.0 billion in fiscal year 2009.

Reference Number: IIA2010042237e

Gerhard Stauss | Siemens Industry
Further information:

More articles from Machine Engineering:

nachricht Process-Integrated Inspection for Ultrasound-Supported Friction Stir Welding of Metal Hybrid-Joints
27.09.2016 | Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP

nachricht Lightweight robots in manual assembly
13.09.2016 | Fraunhofer-Institut für Arbeitswirtschaft und Organisation IAO

All articles from Machine Engineering >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Etching Microstructures with Lasers

Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.

This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...

Im Focus: Light-driven atomic rotations excite magnetic waves

Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion

Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...

Im Focus: New 3-D wiring technique brings scalable quantum computers closer to reality

Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.

"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...

Im Focus: Scientists develop a semiconductor nanocomposite material that moves in response to light

In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.

A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...

Im Focus: Diamonds aren't forever: Sandia, Harvard team create first quantum computer bridge

By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.

"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...

All Focus news of the innovation-report >>>



Event News

#IC2S2: When Social Science meets Computer Science - GESIS will host the IC2S2 conference 2017

14.10.2016 | Event News

Agricultural Trade Developments and Potentials in Central Asia and the South Caucasus

14.10.2016 | Event News

World Health Summit – Day Three: A Call to Action

12.10.2016 | Event News

Latest News

Greater Range and Longer Lifetime

26.10.2016 | Power and Electrical Engineering

VDI presents International Bionic Award of the Schauenburg Foundation

26.10.2016 | Awards Funding

3-D-printed magnets

26.10.2016 | Power and Electrical Engineering

More VideoLinks >>>