With the new version 10.1 of the Comos software solution, the Siemens Industry Automation Division is expanding its range of industrial software for the process industry in plant engineering and plant management.
New Comos version sustainably improves efficiency in plant Management
The Comos Enterprise Platform for efficient and system-wide cooperation was further developed using the new Comos industrial database (Comos iDB). It is designed for sector-specific requirements in a wide variety of industries.
New projects can be installed quickly and easily, because fewer customer-specific adaptations are required. The Comos Enterprise Platform ensures fast data processing and secure data management even with an increasing volume of project data.
Integration of the Comos software solution with the Simatic process control system PCS 7 enables the engineer or operator to integrate process plant engineering with central data management. The consistent and bidirectional exchange of information between the two systems has been developed further in order to save time and costs in overall plant engineering. For example, sequence controls, types and instances functionally engineered in Comos can now be transferred to a plant-specific automation function.
An additional innovation for plant management is the further development of Comos Walkinside. In Comos 10.1, the powerful 3D visualization software provides a very realistic representation of plants of any complexity even before commissioning. Comos Walkinside directly accesses the data in Comos. Due to the logical connection of geometrical objects with the engineering data, the 3D image of the plant is constantly kept up-to-date throughout the entire lifecycle of the plant. Head-mounted devices (virtual reality glasses) and gamepads to control the virtual characters give users the impression that they are really moving around in the plant. Comos Walkinside can be used for design reviews, simulation or operational engineering, for example. Furthermore, training can take place under realistic and safe conditions before a plant has been commissioned.
In addition to this, further new developments and functional expansions help to increase the efficiency of data management throughout the entire lifecycle of a plant and facilitate decision-making for users and management.
With respect to piping and instrumentation (P&ID), with Comos 10.1, users can now for the first time link PDF documents, such as piping and instrumentation flow diagrams, to a process picture in Comos P&ID or transfer them in full. The new import function can make the manual mapping of P&IDs easier or even unnecessary. This saves the user time and reduces potential data inconsistencies.
Siemens consistently promotes the integration of its industrial software range for the product and plant lifecycle - with interfaces to both its own products and products from other manufacturers. In this way, for example, components and catalogs can be synchronized even more efficiently with the Teamcenter PLM (Product Lifecycle Management) software from Siemens via the new Process Data Interface of Comos 10.1. In addition, in the new release, plant structures from the Comos 2D engineering can be exchanged and synchronized with the 3D design in NX, the Siemens software for digital product design. The compatibility of Comos with Probad, the IBM calculation software for designing printed parts, has also been expanded further.
More information about Comos is available on the Internet at: www.siemens.com/comosFollow us on Twitter: www.twitter.com/siemens_press
The Siemens Industry Automation Division (Nuremberg, Germany) supports the entire value chain of its industrial customers – from product design to production and services – with an unmatched combination of automation technology, industrial control technology, and industrial software. With its software solutions, the Division can shorten the time-to-market of new products by up to 50 percent. Industry Automation comprises five Business Units: Industrial Automation Systems, Control Components and Systems Engineering, Sensors and Communications, Siemens PLM Software, and Water Technologies. For more information, visit http://www.siemens.com/industryautomation
Reference Number: IIA2013103009eContact
Gerhard Stauss | Siemens Industry
Process-Integrated Inspection for Ultrasound-Supported Friction Stir Welding of Metal Hybrid-Joints
27.09.2016 | Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren IZFP
Lightweight robots in manual assembly
13.09.2016 | Fraunhofer-Institut für Arbeitswirtschaft und Organisation IAO
Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.
This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...
Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion
Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
26.10.2016 | Power and Electrical Engineering
26.10.2016 | Awards Funding
26.10.2016 | Power and Electrical Engineering