Over the next 12 months, CEA/Leti will manufacture test chips using a combination of D2S’ advanced DFEB design and software capabilities and latest high-resolution e-beam direct-write (EbDW) lithography equipment from Vistec. The goal of this collaboration is to print 45- and 32-nm circuits using Vistec Electron Beam’s SB3054 system installed at CEA/Leti.
D2S’ proprietary DFEB solution encourages and isolates the most commonly recurring patterns of chip designs and translates them into templates on “mini-reticles”. A prepared set of templates on a mini-reticle then allows these complex patterns to be replicated in a single shot on a wafer. This is accomplished using Vistec’s SB3054 tool utilizing CP technology. By reducing a design’s required shot count, this approach improves throughput over VSB while enhancing accuracy.
Laurent Pain, lithography laboratory manager at CEA/Leti, stated, “DFEB is an innovative, new approach to the old problem of boosting e-beam throughput while enhancing accuracy. We are looking forward to this collaboration to validate accuracy and throughput goals at the 45- and 32-nm nodes using the Vistec SB3054 system in tandem with D2S’ advanced DFEB solution.”
“We see the integrated CP functionality and DFEB software as a bridge between the high-resolution requirements of advanced R&D and the challenging throughput expectations driven by industrial prototyping applications,” said Wolfgang Dorl, general manager at Vistec Electron Beam. “The CP feature is available today from Vistec and was recently installed at CEA/Leti to enable this collaboration and research.”
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