Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

Vistec, CEA/Leti and D2S join forces on e-beam direct write solutions for the 45- and 32-nm nodes

13.01.2009
E-beam supplier Vistec, along with semiconductor research group CEA/Leti, and emerging design and software company D2S, today announced a collaboration focused on refining and validating advanced design-for-e-beam (DFEB) solutions for the 45- and 32-nm nodes.

Over the next 12 months, CEA/Leti will manufacture test chips using a combination of D2S’ advanced DFEB design and software capabilities and latest high-resolution e-beam direct-write (EbDW) lithography equipment from Vistec. The goal of this collaboration is to print 45- and 32-nm circuits using Vistec Electron Beam’s SB3054 system installed at CEA/Leti.

High speed, low cost
Driving the need for this joint effort is the ever-rising cost of semiconductor masks, which is making low-volume production of custom ICs economically infeasible. Using an e-beam tool to directly write patterns onto a wafer has always been the most accurate way to pattern a semiconductor wafer; however, low throughput using a traditional variable shaped beam (VSB) approach has limited its application. By efficiently employing character or cell projection (CP) technology to re-write the throughput rules around EbDW, the DFEB solution virtually eliminates the cost of masks and can speed time to market by shortening the design-to-lithography process flow.

D2S’ proprietary DFEB solution encourages and isolates the most commonly recurring patterns of chip designs and translates them into templates on “mini-reticles”. A prepared set of templates on a mini-reticle then allows these complex patterns to be replicated in a single shot on a wafer. This is accomplished using Vistec’s SB3054 tool utilizing CP technology. By reducing a design’s required shot count, this approach improves throughput over VSB while enhancing accuracy.

Solutions for a new production paradigm
“Ever increasing mask costs are presenting numerous challenges in the semiconductor industry”, said Aki Fujimura, founder and chief executive officer of D2S. “Combining EbDW with CP provides a low-risk, low-cost path to a new production paradigm. Producers of high value, low-volume devices will be the beneficiaries of this joint effort to validate direct-write-e-beam solutions at leading edge technology nodes—thanks in part to our DFEB ecosystem partners, CEA/Leti and Vistec”.

Laurent Pain, lithography laboratory manager at CEA/Leti, stated, “DFEB is an innovative, new approach to the old problem of boosting e-beam throughput while enhancing accuracy. We are looking forward to this collaboration to validate accuracy and throughput goals at the 45- and 32-nm nodes using the Vistec SB3054 system in tandem with D2S’ advanced DFEB solution.”

“We see the integrated CP functionality and DFEB software as a bridge between the high-resolution requirements of advanced R&D and the challenging throughput expectations driven by industrial prototyping applications,” said Wolfgang Dorl, general manager at Vistec Electron Beam. “The CP feature is available today from Vistec and was recently installed at CEA/Leti to enable this collaboration and research.”

Clément Moulet | alfa
Further information:
http://www.cea.fr

More articles from Power and Electrical Engineering:

nachricht Researchers pave the way for ionotronic nanodevices
23.02.2017 | Aalto University

nachricht Microhotplates for a smart gas sensor
22.02.2017 | Toyohashi University of Technology

All articles from Power and Electrical Engineering >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Safe glide at total engine failure with ELA-inside

On January 15, 2009, Chesley B. Sullenberger was celebrated world-wide: after the two engines had failed due to bird strike, he and his flight crew succeeded after a glide flight with an Airbus A320 in ditching on the Hudson River. All 155 people on board were saved.

On January 15, 2009, Chesley B. Sullenberger was celebrated world-wide: after the two engines had failed due to bird strike, he and his flight crew succeeded...

Im Focus: Breakthrough with a chain of gold atoms

In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport

In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport

Im Focus: DNA repair: a new letter in the cell alphabet

Results reveal how discoveries may be hidden in scientific “blind spots”

Cells need to repair damaged DNA in our genes to prevent the development of cancer and other diseases. Our cells therefore activate and send “repair-proteins”...

Im Focus: Dresdner scientists print tomorrow’s world

The Fraunhofer IWS Dresden and Technische Universität Dresden inaugurated their jointly operated Center for Additive Manufacturing Dresden (AMCD) with a festive ceremony on February 7, 2017. Scientists from various disciplines perform research on materials, additive manufacturing processes and innovative technologies, which build up components in a layer by layer process. This technology opens up new horizons for component design and combinations of functions. For example during fabrication, electrical conductors and sensors are already able to be additively manufactured into components. They provide information about stress conditions of a product during operation.

The 3D-printing technology, or additive manufacturing as it is often called, has long made the step out of scientific research laboratories into industrial...

Im Focus: Mimicking nature's cellular architectures via 3-D printing

Research offers new level of control over the structure of 3-D printed materials

Nature does amazing things with limited design materials. Grass, for example, can support its own weight, resist strong wind loads, and recover after being...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

Booth and panel discussion – The Lindau Nobel Laureate Meetings at the AAAS 2017 Annual Meeting

13.02.2017 | Event News

Complex Loading versus Hidden Reserves

10.02.2017 | Event News

International Conference on Crystal Growth in Freiburg

09.02.2017 | Event News

 
Latest News

New pop-up strategy inspired by cuts, not folds

27.02.2017 | Materials Sciences

Sandia uses confined nanoparticles to improve hydrogen storage materials performance

27.02.2017 | Interdisciplinary Research

Decoding the genome's cryptic language

27.02.2017 | Life Sciences

VideoLinks
B2B-VideoLinks
More VideoLinks >>>