Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:

 

CEA-Léti and Fraunhofer Microeletronics Alliance Extend their Cooperation

05.11.2004


CEA-Léti and Fraunhofer Microelectronics Alliance (VµE), two of the largest organizations for applied research in the field of micro and nanoelectronics in Europe, have signed an extension of their 2003 cooperation agreement, now including front-end technologies for micro and nanoelectronics.

The document was signed in a ceremony on the occasion of the Annual Conference 2004 of Fraunhofer IISB in Erlangen, Germany, competence center for front-end technologies within the VµE. CEA-Léti was represented by its director Bernard Bar-bier, and VµE by Herbert Reichl, head of the VµE steering committee.

While the initial agreement, which had been signed in September 2003, covered cooperation on wafer level packaging and heterogeneous integration - the so-called "back-end" - the current extension adds "front-end technologies for micro and nanoelectronics, encompassing processes/equipment, simulation, characterization, and new materials". As a result, the cooperation agreement now includes practically all crucial aspects of semiconductor technology for micro and nanoelectronics, paving the way for a successful European cooperation in an economically but also socially extremely important field of research and development, characterized by harsh inter-national competition.



Thus, joint efforts, exchange, and intensified common R&D by the French and German partners will prove to be beneficial for European research and economy. Big research institutes like CEA-Léti and Fraunhofer VµE are bridging the gap between basic research at universities and the industrial application at the European semicon-ductor companies. Together with other European partners, the goal is to establish and coordinate a powerful and efficient research network on micro and nanoelec-tronics.

Bernard Barbier explains: "It is a step forward in this already very valuable cooperation, reinforcing the German-French links. The complementary expertise of the two organizations will benefit the European industry, especially through the two clusters around the Fraunhofer Microelectronics Alliance in Germany and Grenoble in France, along with building an important contribution to the European Technology Platform on Nanoelectronics."

Herbert Reichl adds: "New technologies are the base for innovative products. Research and development has to create an attractive infrastructure for product design in Europe. To enhance the efficiency of R&D, a strong cooperation and common strategy of the main European research institutions is necessary. The cooperation of CEA-Léti and Fraunhofer-Gesellschaft is a first important step into this direction."

Dr. Bernd Fischer | idw
Further information:
http://www.iisb.fraunhofer.de
http://www.vue.fraunhofer.de
http://www-leti.cea.fr

More articles from Power and Electrical Engineering:

nachricht Researchers pave the way for ionotronic nanodevices
23.02.2017 | Aalto University

nachricht Microhotplates for a smart gas sensor
22.02.2017 | Toyohashi University of Technology

All articles from Power and Electrical Engineering >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Breakthrough with a chain of gold atoms

In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport

In the field of nanoscience, an international team of physicists with participants from Konstanz has achieved a breakthrough in understanding heat transport

Im Focus: DNA repair: a new letter in the cell alphabet

Results reveal how discoveries may be hidden in scientific “blind spots”

Cells need to repair damaged DNA in our genes to prevent the development of cancer and other diseases. Our cells therefore activate and send “repair-proteins”...

Im Focus: Dresdner scientists print tomorrow’s world

The Fraunhofer IWS Dresden and Technische Universität Dresden inaugurated their jointly operated Center for Additive Manufacturing Dresden (AMCD) with a festive ceremony on February 7, 2017. Scientists from various disciplines perform research on materials, additive manufacturing processes and innovative technologies, which build up components in a layer by layer process. This technology opens up new horizons for component design and combinations of functions. For example during fabrication, electrical conductors and sensors are already able to be additively manufactured into components. They provide information about stress conditions of a product during operation.

The 3D-printing technology, or additive manufacturing as it is often called, has long made the step out of scientific research laboratories into industrial...

Im Focus: Mimicking nature's cellular architectures via 3-D printing

Research offers new level of control over the structure of 3-D printed materials

Nature does amazing things with limited design materials. Grass, for example, can support its own weight, resist strong wind loads, and recover after being...

Im Focus: Three Magnetic States for Each Hole

Nanometer-scale magnetic perforated grids could create new possibilities for computing. Together with international colleagues, scientists from the Helmholtz Zentrum Dresden-Rossendorf (HZDR) have shown how a cobalt grid can be reliably programmed at room temperature. In addition they discovered that for every hole ("antidot") three magnetic states can be configured. The results have been published in the journal "Scientific Reports".

Physicist Dr. Rantej Bali from the HZDR, together with scientists from Singapore and Australia, designed a special grid structure in a thin layer of cobalt in...

All Focus news of the innovation-report >>>

Anzeige

Anzeige

Event News

Booth and panel discussion – The Lindau Nobel Laureate Meetings at the AAAS 2017 Annual Meeting

13.02.2017 | Event News

Complex Loading versus Hidden Reserves

10.02.2017 | Event News

International Conference on Crystal Growth in Freiburg

09.02.2017 | Event News

 
Latest News

Stingless bees have their nests protected by soldiers

24.02.2017 | Life Sciences

New risk factors for anxiety disorders

24.02.2017 | Life Sciences

MWC 2017: 5G Capital Berlin

24.02.2017 | Trade Fair News

VideoLinks
B2B-VideoLinks
More VideoLinks >>>