New research from the National Institute of Standards and Technology (NIST) suggests that next-generation, high-temperature superconductor (HTS) wire can withstand more mechanical strain than originally thought. As a result, superconductor power cables employing this future wire may be used for transmission grid applications. Projected to become available in three to four years, the advanced superconductor wire (known in the industry as second generation HTS wire) is expected to cost less than the HTS wire used in todays superconductor power cables. The NIST research is described in the Nov. 17 issue of Applied Physics Letters.
Superconductor power cables can carry three to five times the power of conventional copper cables. Compact, underground superconductor cables can be used to expand capacity and direct power flows at strategic points on the electric power grid and can be used in city centers where there is enormous demand, but little space under the streets for additional copper cables. One important challenge in using this next-generation HTS wire in such applications is the need for sufficient strength and resiliency to withstand the stretching and bending that occurs during power cable fabrication and installation.
Using superconductor ceramic coatings on metallic substrates fabricated by American Superconductor Corp. and Oak Ridge National Laboratory, the NIST researchers tested the materials electromechanical properties. According to lead author Najib Cheggour, they found that these advanced wires could stretch almost twice as much as previously believed without any cracking of the superconductor coating and with almost no loss in the coatings ability to carry electricity.
Fred McGehan | EurekAlert!
Fluorescent holography: Upending the world of biological imaging
25.10.2016 | Colorado State University
Did you know that infrared heating is an essential part of automotive manufacture?
25.10.2016 | Heraeus Noblelight GmbH
Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.
This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...
Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion
Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
25.10.2016 | Earth Sciences
25.10.2016 | Power and Electrical Engineering
25.10.2016 | Process Engineering