A new scanning microscope developed at Brown University can uncover defects in the smallest and most complex integrated circuits at a resolution 1,000 times greater than current technology. The scanner removes a barrier to further shrinking of integrated circuits: As circuits get smaller, non-visual defects become harder to find.
Micro mouse bite
A current-density image, taken with a Circuit Scan 1000 high-resolution magnetic microscope, reveals a tiny flaw in one of two 0.25-micron metal wires in an integrated circuit chip. Further magnification (detail) shows the right-hand wire has a “mouse bite” along one of its edges, where the electrical current shows up as a tiny hot spot
“This microscope will allow manufacturers to find defects in each embedded wire in ever-tinier circuits,” said Brown University professor Gang Xiao. He developed the instrument’s hardware and software with Ben Schrag, who will receive his Ph.D. at Brown this month.
The microscope’s magnetic-scanning technology suggests a new small, non-invasive form of remote detection, said the researchers, who envision a “pass-over and detect” magnetic-sensor-tipped pen, for use in finding internal cracks within aircraft, sensing biological agents in the environment or body, or recognizing counterfeit bills or other objects.
Scott Turner | Brown University
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Satellites in near-Earth orbit are at risk due to the steady increase in space debris. But their mission in the areas of telecommunications, navigation or weather forecasts is essential for society. Fraunhofer FHR therefore develops radar-based systems which allow the detection, tracking and cataloging of even the smallest particles of debris. Satellite operators who have access to our data are in a better position to plan evasive maneuvers and prevent destructive collisions. From April, 25-29 2018, Fraunhofer FHR and its partners will exhibit the complementary radar systems TIRA and GESTRA as well as the latest radar techniques for space observation across three stands at the ILA Berlin.
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Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP, provider of research and development services for OLED lighting solutions, announces the founding of the “OLED Licht Forum” and presents latest OLED design and lighting solutions during light+building, from March 18th – 23rd, 2018 in Frankfurt a.M./Germany, at booth no. F91 in Hall 4.0.
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