Forum for Science, Industry and Business

Sponsored by:     3M 
Search our Site:


IMEC demonstrates 3D stacked integrated

IMEC, Europe’s leading independent nanoelectronics research institute today announced that it has made significant progress with its 3D-SIC (3D stacked IC) technology.

IMEC recently demonstrated the first functional 3D integrated circuits obtained by die-to-die stacking using 5µm Cu through-silicon vias (TSV). It will now further develop 3D SIC chips on 200mm and 300mm wafers, integrating test circuits from partners participating in its 3D integration research program.

IMEC reported a first-time demonstration of 3D integrated circuits obtained by die-to-die stacking and using 5µm Cu through-silicon vias (TSV). The dies were realized on 200mm wafers in IMEC’s reference 0.13µm CMOS process with an added Cu-TSVs process.

For stacking, the top die was thinned down to 25µm and bonded to the landing die by Cu-Cu thermocompression. IMEC is upscaling the process for die-to-wafer bonding and is on track for migrating the process to its 300mm platform.

To evaluate the impact of the 3D SIC flow on the characteristics of the stacked layers, both the top and landing wafers contained CMOS circuits. Extensive tests confirmed that the performance of the circuits does not degrade with adding Cu TSVs and stacking. And to test the integrity and performance of the 3D stack, ring oscillators with varying configurations were made, distributed over the two chip layers and connected with the Cu TSVs. Tested after the TSV and stacking process, these circuits demonstrated the chips excellent integrity.

“With these tests, we have demonstrated that our technology allows designing and fabricating fully functional 3D SIC chips. We are now ready to accept reference test circuits from our industry partners,” commented Eric Beyne, IMEC Scientific Director for 3D Technologies, “This will enable the industry to gain early insight and experience with 3D SIC design, using their own designs”.

Katrien Marent | alfa
Further information:

More articles from Power and Electrical Engineering:

nachricht Solid progress in carbon capture
27.10.2016 | King Abdullah University of Science & Technology (KAUST)

nachricht Greater Range and Longer Lifetime
26.10.2016 | Technologie Lizenz-Büro (TLB) der Baden-Württembergischen Hochschulen GmbH

All articles from Power and Electrical Engineering >>>

The most recent press releases about innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Etching Microstructures with Lasers

Ultrafast lasers have introduced new possibilities in engraving ultrafine structures, and scientists are now also investigating how to use them to etch microstructures into thin glass. There are possible applications in analytics (lab on a chip) and especially in electronics and the consumer sector, where great interest has been shown.

This new method was born of a surprising phenomenon: irradiating glass in a particular way with an ultrafast laser has the effect of making the glass up to a...

Im Focus: Light-driven atomic rotations excite magnetic waves

Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion

Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...

Im Focus: New 3-D wiring technique brings scalable quantum computers closer to reality

Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.

"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...

Im Focus: Scientists develop a semiconductor nanocomposite material that moves in response to light

In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.

A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...

Im Focus: Diamonds aren't forever: Sandia, Harvard team create first quantum computer bridge

By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.

"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...

All Focus news of the innovation-report >>>



Event News

#IC2S2: When Social Science meets Computer Science - GESIS will host the IC2S2 conference 2017

14.10.2016 | Event News

Agricultural Trade Developments and Potentials in Central Asia and the South Caucasus

14.10.2016 | Event News

World Health Summit – Day Three: A Call to Action

12.10.2016 | Event News

Latest News

How nanoscience will improve our health and lives in the coming years

27.10.2016 | Materials Sciences

OU-led team discovers rare, newborn tri-star system using ALMA

27.10.2016 | Physics and Astronomy

'Neighbor maps' reveal the genome's 3-D shape

27.10.2016 | Life Sciences

More VideoLinks >>>