Even a conventional mobile phone user demands more functions and better performance of his mobile phone in the smallest possible space. The mobile phone should also be easy to use, reliable and inexpensive. In order to meet these demands, more data and functions than before must be packed into the circuit boards of mobile phones in the future.
The researchers at the Helsinki University of Technology have met this challenge by developing a new type of production method for electronics, a so-called IMB (Integrated Module Board) technology. Due to this technology, the performance of an electronics product is improved, more functions can be added to a smaller space than before and the reliability of the mobile phone is improved further.
"When we started to develop miniaturised electronics products, we wanted to get rid of the casings of the microchips to be packed onto the circuit board, because they took up too much space. The size of conventional microchip casings may be ten times as big as the actual microchip," Professor Jorma Kivilahti, the director of the Laboratory of Electronics Production Technology of the Helsinki University of Technology, explains.
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