Advanced materials like AlTiC, sapphire and SiC are now commonly used in many devices. One popular area that they are applied in is read/write head sliders for computer hard drives. A major practical problem with the use of these materials is that they are extremely difficult to machine, and the advanced applications they are used in require precise tolerances for finished dimensions.
The small components are cut from larger wafers of material using systems that have constant feed speeds. However performance of the dicing blades degrades over time due to the deterioration of their surface conditions, i.e., dislodgment or dullness of abrasive grains, deformations and abrasion of the matrix material. This alters the grindability or cutting performance of the blades. A better understanding of the mechanisms governing grindability could be applied to producing better components machined from very hard materials.
A team of Japanese researchers, Takuya Adachi, Koji Matsumaru and Kozo Ishizaki, from Nagaoka University of Technology have developed a constant feeding-force system, which enables the grindability of a grinding wheel to be analysed. Under constant feeding-force system, the feeding speed alters during processing, which depends on the surface conditions of a grinding wheel, and indicates its grindability.
In this study, the theoretical grindability of dicing blades was estimated by establishing a new model for feeding speeds under constant feeding-force dicing systems. The model was evaluated by comparing empirical and theoretical dicing speeds for different abrasive grain sizes. The researchers were able to conclude that the grindability of dicing blades depends on the abrasive grains size, number and distribution on the surface of the dicing blade.
Dr. Ian Birkby | EurekAlert!
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Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
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In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
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By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
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COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.
In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...
'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.
Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...
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21.10.2016 | Materials Sciences