If all goes as planned, two rovers named Spirit and Opportunity will explore the surface of Mars next year, gathering a wealth of geologic information and beaming the results back to Earth. However, the environment is so extreme that the rovers will be equipped with heaters to keep the electronic gear warm enough to operate properly over the Martian winter when temperatures can dip to -120 degrees C. Future space probes will involve even more extreme environments, with temperatures as high as 460 degrees Celsius (860 degrees Fahrenheit) on Venus and as low as -180 Celsius (-292 Fahrenheit) on Titan, the largest moon of Saturn.
George Harman, a world authority on materials for microelectronic interconnections and packaging at the National Institute of Standards and Technology (NIST), recently made a workshop presentation for National Aeronautics and Space Administration (NASA) engineers at the Jet Propulsion Laboratory on designing semiconductor device interconnections to withstand extreme space environments.
Harman recommended that spacebound microelectronics interconnections be made with corrosion resis-tant, highly stable metals, especially gold. He also suggested the use of some newer polymers that can withstand extreme temperatures but are not yet used in the space program. "Flip chips" are another interconnection approach, that, with proper metallurgy, may make sense in high-temperature planetary environments. Instead of using wire leads around the edges of a microchip to export electrical signals, flip chips normally use a pattern of ball-shaped solder contacts that are attached directly on the chip surface. Harman suggested that NASA consider using flip chips designed with gold contacts to produce spacecraft electronics that are both space-saving and heat resistant.
Phil Bulman | EurekAlert!
From ancient fossils to future cars
21.10.2016 | University of California - Riverside
Study explains strength gap between graphene, carbon fiber
20.10.2016 | Rice University
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.
In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...
'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.
Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
21.10.2016 | Health and Medicine
21.10.2016 | Information Technology
21.10.2016 | Materials Sciences