The process, devised by researchers in NYU's Courant Institute of Mathematical Sciences and Department of Physics, offers a potential technique for material cutting and manufacturing processes.
Their work is described in the journal Physical Review Letters.
Manufacturers use a variety of methods for shaping solid materials, ranging from laser cutting to high-speed jets of water. While altering the shape of such materials, such as glass, metal, or stone, is relatively straightforward, doing so with precision often proves challenging.
With this in mind, the NYU researchers sought to create an alternative, but rudimentary, method to shape solid materials in a precise fashion. To do so, they considered a process involving a corn starch solution.
Similar solutions have proved valuable in creating body armor—but for different reasons. The molecules in these fluids—also called shear-thickening fluids—are closely packed, but loosely arranged. Under most conditions, they flow like most liquids. However, when met with pressure from an object or other force, its particles interlock and the fluid acts like a solid. Body armor comprised of shear-thickening fluids, when met with bullets, become hard and deflect incoming projectiles.
The NYU researchers sought to apply these principles in a different manner. Instead of using the solution to deflect objects, they aimed to use it as part of a process to shape solid materials—in this case, a wall of modeling clay.
To do this, they submerged a motor-powered, plastic sphere through the cornstarch solution toward a containing wall made of modeling clay, stopping just short of the wall. Using the force of the sphere to harden the cornstarch solution, the researchers were able to make indentations in the wall of modeling clay. In addition, they were able to do so with a degree of precision by taking into account speed, force, and geometry. By moving the sphere at fast speeds through the solution, they created large depressions in the clay; by slowing it down, they created smaller depressions.
The study's authors were: Bin Liu, a post-doctoral researcher in NYU's Department of Physics, Michael Shelley, a professor in NYU's Courant Institute of Mathematical Sciences; and Jun Zhang, a professor in NYU's Department of Physics and Courant Institute.
The research was supported by grants from the National Science Foundation and the Department of Energy.
James Devitt | EurekAlert!
From ancient fossils to future cars
21.10.2016 | University of California - Riverside
Study explains strength gap between graphene, carbon fiber
20.10.2016 | Rice University
Terahertz excitation of selected crystal vibrations leads to an effective magnetic field that drives coherent spin motion
Controlling functional properties by light is one of the grand goals in modern condensed matter physics and materials science. A new study now demonstrates how...
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.
In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
24.10.2016 | Earth Sciences
24.10.2016 | Life Sciences
24.10.2016 | Physics and Astronomy