Prior to the production of prototypes, adhesive tests have hitherto only been undertaken on coupon specimens. Researchers at Fraunhofer IWES, together with industrial partners, have now developed a subcomponent test as an intermediate step. This provides additional understanding of material behavior on a structure-relevant scale. This more comprehensive approach reduces uncertainty for scale-up process to subcomponent design stage.
The aim of the UpWind project was to develop accurate, verified tools and component concepts for very large wind turbines (8-10 MW), both onshore and offshore. Ever longer rotor blades are being used for multi-megawatt wind turbines. They usually consist of two half-shells, which are bonded together with special adhesive. The loads that act on the bonded joint and the requirement for a service life of 20 years put extreme demands on the bond line. The latter can have a thickness of about 10 millimeters and a length of about 60 meters.More realistic load distribution
enhanced by parallel industry projects done with Henkel. A “beam in bending” test methodology that was has been developed in collaboration with Henkel was the starting point of the improvement.
“Knowledge of the physical properties of our products under in-service conditions is essential for successful applications,” explains Felix Kleiner, Manager of Adhesive Engineering at Henkel AG & Co. KGaA. “The new test method allows economic evaluation of different adhesives and design variations”. The base model that was used for this was an I-beam - a model which takes into account two bonded seams between spar cap - shear web - spar cap.Enhanced understanding of material behavior
From ancient fossils to future cars
21.10.2016 | University of California - Riverside
Study explains strength gap between graphene, carbon fiber
20.10.2016 | Rice University
Researchers from the Institute for Quantum Computing (IQC) at the University of Waterloo led the development of a new extensible wiring technique capable of controlling superconducting quantum bits, representing a significant step towards to the realization of a scalable quantum computer.
"The quantum socket is a wiring method that uses three-dimensional wires based on spring-loaded pins to address individual qubits," said Jeremy Béjanin, a PhD...
In a paper in Scientific Reports, a research team at Worcester Polytechnic Institute describes a novel light-activated phenomenon that could become the basis for applications as diverse as microscopic robotic grippers and more efficient solar cells.
A research team at Worcester Polytechnic Institute (WPI) has developed a revolutionary, light-activated semiconductor nanocomposite material that can be used...
By forcefully embedding two silicon atoms in a diamond matrix, Sandia researchers have demonstrated for the first time on a single chip all the components needed to create a quantum bridge to link quantum computers together.
"People have already built small quantum computers," says Sandia researcher Ryan Camacho. "Maybe the first useful one won't be a single giant quantum computer...
COMPAMED has become the leading international marketplace for suppliers of medical manufacturing. The trade fair, which takes place every November and is co-located to MEDICA in Dusseldorf, has been steadily growing over the past years and shows that medical technology remains a rapidly growing market.
In 2016, the joint pavilion by the IVAM Microtechnology Network, the Product Market “High-tech for Medical Devices”, will be located in Hall 8a again and will...
'Ferroelectric' materials can switch between different states of electrical polarization in response to an external electric field. This flexibility means they show promise for many applications, for example in electronic devices and computer memory. Current ferroelectric materials are highly valued for their thermal and chemical stability and rapid electro-mechanical responses, but creating a material that is scalable down to the tiny sizes needed for technologies like silicon-based semiconductors (Si-based CMOS) has proven challenging.
Now, Hiroshi Funakubo and co-workers at the Tokyo Institute of Technology, in collaboration with researchers across Japan, have conducted experiments to...
14.10.2016 | Event News
14.10.2016 | Event News
12.10.2016 | Event News
21.10.2016 | Health and Medicine
21.10.2016 | Information Technology
21.10.2016 | Materials Sciences