Fraunhofer Institute Reliability and Microintegration

The Fraunhofer Institute for Reliability and Microintegration IZM was set up in Berlin in 1993 and soon became one of the leading experts on microelectronics and microsystems packaging worldwide.

Main activities are research and development in the field of microelectronic packaging, including processes and technologies, test methods and reliability procedures for future system integration. An extensive range of services facilitates the fast transfer of the latest research results to industry. Supporting firms in the broad application of future packaging technologies is one of the institute´s main objectives. The focus lies mainly on:

• Material and substrate development, characterization and simultation
  
• Advanced system engineering
  
• Assembly and interconnection technologies
  
• Environmental engineering

Together with the Research Center for Microperipheric Technologies at the Technical University of Berlin, the Fraunhofer IZM meets industry´s demands in these fields.

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Further Information: www.izm.fraunhofer.de