Findings have implications for semiconductor industry
Snapshots illustrating the products formed by the addition of an organic molecule (butadiene) to a silicon surface. Green spheres denote carbon, white spheres denote hydrogen, blue spheres denote silicon, grey spheres and blue surfaces denote centers of high electron density, and red spheres denote local positive charge.
Chemists at New York University have elucidated a mechanism by which organic molecules attach to semiconductor surfaces, a finding that has implications for the semiconductor industry. The industry has sought ways to exploit the attachment process for a variety of purposes. The findings, along with a review of the methodology employed in the study, appear in the latest issue of the Proceedings of the National Academy of Sciences and build on studies published by the same team in the Journal of the American Chemical Society.
Mark Tuckerman, an associate professor in NYUs Department of Chemistry and its Courant Institute of Mathematical Sciences, along with graduate student Peter Minary and postdoctoral researcher Radu Iftimie, examined how a butadiene, a particular organic molecule, binds to a particular silicon surface using first-principles computer-based models (Iftimie is now an assistant professor at the University of Montreal, and Minary is a postdoctoral researcher at Stanford University).
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